Thermal interface under a plastic quad flat pack
Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available...
View ArticleThe Role of Natural Graphite in Electronics Cooling
Graphite is available as a variety of different material forms, the most useful in the electronics cooling market being pyrolytic graphite, graphite fiber reinforced carbon and polymer matrix...
View ArticleOptical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal...
Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was...
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